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Aerospace MEMS Pressure Transducer Packaging Techniques to Withstand Surge Pressure and Radiation

R Narayan1 *, Karthikeyan L1, Aisha Sidhick SM1, M V N Prasad2 and G L Shekar3

1Liquid Propulsion Systems Centre, ISRO, 80 Feet Road,
HAL 2nd Stage, Bangalore, Karnataka-560008, INDIA.
2Rtd Group Director-SRDG, Liquid Propulsion Systems Centre, ISRO, 80 Feet Road, HAL 2nd stage, Bangalore, Karnataka-560008, INDIA.
3National Institute of engineering, Mysore, Karnataka, INDIA.

ABSTRACT

In the field of aerospace engineering pressure measurement is playing a vital role in terms of health monitoring of the system and control application. MEMS technology based pressure sensors are extremely appealing for optimizing the size and mass of aerospace system sensors with improvement in their functional performance. In view of the harsh and remote environment of aerospace application, reliability and repeatability are the crucial issues that are holding back MEMS from playing a larger role in space applications. The presently used sensors for pressure measurement have limitations concerning sensitivity, accuracy and long-term stability. The aerospace application involving MEMS based pressure sensors is of particular interest in this study and analysis. However, it has several challenges namely viz., efficient packaging, interface, immunity to radiation and tolerances on assembly and final testing and evaluation. These sensors have to work under harsh and volatile environments, which demands utmost reliability, and long-term performance stability.

In launch vehicle and ground testing of propulsion systems application, the performance of this pressure sensors is very critical to analyse with respect to performance of the vehicle and its subsystems. Hence, the design and packaging of MEMS transducers have to be done in such a way that it has to withstand all the fight against the environmental conditions. In this article, the impact of surge pressure and radiation effects on MEMS pressure transducer along with the design improvement techniques are presented.

Keywords : MEMS, Pressure sensing, Harsh environment, Surge pressure.